I-P-Type yeglasi enye yeePaneli zeSolar 54hc-Bdvp 395-415 Watt Bifacial Module
Iinkcukacha zeMveliso
Iseli yelanga, ekwabizwa ngokuba yi "solar chip" okanye "photovoltaic cell", lishiti le-optoelectronic semiconductor elisebenzisa ukukhanya kwelanga ukuvelisa umbane ngokuthe ngqo.Iiseli zelanga enye ayinakusetyenziswa ngokuthe ngqo njengomthombo wamandla.Njengomthombo wamandla, iiseli ezininzi zelanga enye kufuneka zidityaniswe kuthotho, ziqhagamshelwe ngokufana kwaye zipakishwe ngokuqinileyo kumacandelo.Iphaneli yelanga yinxalenye engundoqo yenkqubo yokuvelisa amandla elanga kwaye yeyona nxalenye ibalulekileyo yenkqubo yokuvelisa amandla elanga.
Le modyuli yephaneli yelanga ye-P-WH108PA inoluhlu olubanzi lweemeko zesicelo, ezifana ne-BIPV, ukufakwa ngokuthe nkqo, ikhephu, ukufuma okuphezulu kunye neendawo zomoya kunye nesanti.Inkqubo yokuvelisa amandla elanga ye-AC yenziwe ngeepaneli zelanga, izilawuli zentlawulo, ii-inverters kunye neebhetri;imveliso yimodyuli yeglasi enye, kwaye amandla emodyuli anokufikelela: 395W ~ 415W.Amandla aphezulu aphumayo yi-415W, ubuninzi bemodyuli esebenzayo yi-21.3%, ukunyamezela kokukhutshwa kwamandla ngu-0 ~ + 5W, izinga lokunciphisa unyaka wokuqala li-2.00%, kwaye izinga lokunciphisa amandla ngonyaka -0.50%.
Ukusebenza kweMveliso
Iimpawu zeMveliso
1. Itekhnoloji yokunxibelelana kwePassivation inokwenza umphezulu webhetri ufumane isiphumo esihle sokudlulisa ukuthintela ukudlula kwabathwali abambalwa, ukunciphisa ukuhlangana kwakhona kwentsimbi yangoku, ukuphucula umbane wesekethe evulekileyo, isiphaluka esifutshane sangoku kunye nokuzalisa into yebhetri, ngaloo ndlela iphucula kakhulu Ukuphumelela kokuguqulwa kwe-photoelectric yebhetri.
2. Iteknoloji yefilimu yeGradient inokuthintela umbala webhetri ekutshintsheni emva kokutshatyalaliswa, ukuze ugcine umbala wephepha lebhetri uhambelana kunye nokubonakala kweyunifomu yemodyuli kwaye intle.
3. I-teknoloji ye-metallization ye-SMBB inciphisa ngokufanelekileyo ukuxhatshazwa kwechungechunge, kwaye iphucula ukunyamezela kweentsimbi zebhetri, amasango aphukileyo, kunye nokuphuka, ngaloo ndlela kuphuculwe ukuthembeka.Ukuphucula izinga lokusetyenziswa kokukhanya kwesiganeko ngama-70%, ngaloo ndlela ufumana ukunyuka kwamandla nge-1-1.5%.
4. I-lead-free tape ye-solder inendawo ephantsi yokuncibilika kunye nokusetyenziswa kwe-tin ephantsi, enokunciphisa ukushisa kwe-solder, ngaloo ndlela inciphisa umngcipheko wokuqhekeka kwecandelo;i-coefficient yokwandiswa kwe-thermal ye-laminate iphantsi, kwaye amandla obunzima becandelo liphezulu, elinceda ekuphuculeni ukuthembeka.
5. Imodyuli yephaneli yelanga sisixhobo sokuvelisa amandla elanga esiguqula ngokuthe ngqo amandla elanga abe ngumbane othe ngqo wangoku.Izinto ezininzi zinokudityaniswa kuthotho kunye nokuhambelana ukwenza uluhlu lokuvelisa amandla ukunika amandla amakhulu ombane.Imodyuli yeseli yelanga ineempawu zamandla aphezulu kunye nokuthembeka okuphezulu kwemodyuli enye, kwaye ingasetyenziswa yodwa okanye kwi-array.
R & D kunye neMveliso
Imveliso ithatha umgca wokuvelisa ngokuzenzekelayo, kwaye ukusebenza kakuhle kwemveliso kwinqanaba eliphambili kwishishini.Amaxesha ama-3 i-100% yokuhlola okubonakalayo: ngaphambi kokuhlambalaza, emva kwe-lamination, ngaphambi kokupakishwa.Amaxesha ama-3 i-100% yokuhlolwa kwe-EL: umtya webhetri, ngaphambi kokuba i-lamination, ngaphambi kokupakisha.I-100% ye-dielectric yokumelana novavanyo lombane: ukumelana nombane, ukugquma, ukumisa.
Iiparamitha
Ityala lehlabathi
